发明名称 PHOTOCURABLE DICING DIE BONDING TAPE
摘要 A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
申请公布号 WO2012087780(A3) 申请公布日期 2012.11.01
申请号 WO2011US65346 申请日期 2011.12.16
申请人 HENKEL CORPORATION;LEE, BYOUNGCHUL;CHIANG, PAULINE;BECKER, KEVIN, HARRIS 发明人 LEE, BYOUNGCHUL;CHIANG, PAULINE;BECKER, KEVIN, HARRIS
分类号 C09J175/04;C09J7/02;C09J183/02;H01L21/60 主分类号 C09J175/04
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