SELECTIVE THIN FILM REMOVAL APPARATUS USING DIVIDED LASER BEAMS

摘要

Disclosed is a selective thin film removal apparatus using divided laser beams. The thin film removal apparatus of the present invention includes: a beam generating unit for generating an excimer laser beam of a deep UV wavelength; two or more head units for outputting divided beams by dividing the laser beam; a head supporting unit for enabling the head units to move linearly from an upper part of a processing target; a stage which is located at a lower part of each head unit and can be moved on a plane; and a head driving unit for independently moving each head unit from the heat supporting unit to set a location of each head unit. Additionally, the head unit includes: a beam shutter for enabling on/off of the divided beams; a beam homogenizer for improving the uniformity of the divided beams at an upper end of the processing target; and a projection lens unit for reducing the divided beams at an upper part of the processing target.