发明名称 MANUFACTURING METHOD OF COMPOSITE PIEZOELECTRIC SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a composite piezoelectric substrate, capable of forming an ultra-thin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. <P>SOLUTION: Ions are implanted from a surface 2a of a piezoelectric substrate 2 to form a defective layer 4 in a region at a predetermined depth from the surface 2a within the piezoelectric substrate 2. A supporting substrate 10 is bonded to the surface 2a of the piezoelectric substrate 2 to form a bonded substrate body 40. The bonded substrate body 40 is separated at the defective layer 4 formed in the piezoelectric substrate 2 so that a separation layer 3 between the surface 2a of the piezoelectric substrate 2 and the defective layer 4 is separated from the piezoelectric substrate 2 and bonded to the supporting substrate 10 to form a composite piezoelectric substrate 30, and a surface 3a of the separation layer 3 of the composite piezoelectric substrate 30 is smoothed. After ion implantation, polarization treatment of the separation layer 3 of the composite piezoelectric substrate 30 is performed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012213244(A) 申请公布日期 2012.11.01
申请号 JP20120177723 申请日期 2012.08.10
申请人 MURATA MFG CO LTD 发明人 SHINDO HAJIME;YOSHII YOSHIHARU
分类号 H03H3/08;H01L41/22;H01L41/257;H01L41/312;H03H3/02;H03H9/145;H03H9/17 主分类号 H03H3/08
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