| 摘要 |
<p num="1">A diamond wire saw device for cutting a silicon ingot. A multi-layered cutting mesh surface is made of mesh surfaces of wire meshes formed of diamond strands (2) that are parallel to each other and wound on groups of wire guiding wheels (3). The diamond strands (2) on each layer of cutting mesh surface are aligned to each other. The diameters of the diamond strands (2) on the layers of cutting mesh surfaces gradually increase according to a cutting order. The wire diameters of the diamond strands (2) gradually increase and the sizes of diamond abrasives attached thereon gradually decrease. The diamond wire saw device adopts multiple groups of diamond strand cutting mesh surfaces to cut a silicon sheet in sequence, and completes the sub-procedures of cutting, fine grinding, and polishing of a wafer sheet with diamond strands (2) having different attributes according to different operation parameters, so as to achieve a higher utilization of silicon material and meet the development requirements that wire gaps are narrower and cut silicon sheets are thinner.
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