| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE |
| 摘要 |
The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
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| 申请公布号 |
US2012273974(A1) |
申请公布日期 |
2012.11.01 |
| 申请号 |
US201213494474 |
申请日期 |
2012.06.12 |
| 申请人 |
KATOGI SHIGEKI;IZAWA HIROYUKI;SUTOU HOUKO;YUSA MASAMI;FUJINAWA TOHRU;HITACHI CHEMICAL CO., LTD. |
发明人 |
KATOGI SHIGEKI;IZAWA HIROYUKI;SUTOU HOUKO;YUSA MASAMI;FUJINAWA TOHRU |
| 分类号 |
C09J175/14;H01B1/12;H01L23/535;H05K1/11 |
主分类号 |
C09J175/14 |
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