| 发明名称 |
ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES |
| 摘要 |
The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature. |
| 申请公布号 |
US2012272790(A1) |
申请公布日期 |
2012.11.01 |
| 申请号 |
US201213495887 |
申请日期 |
2012.06.13 |
| 申请人 |
LEE KWI-JONG;LEE HYUCK-MO;SONG HYUN-JOON;JO YUN-HWAN;PARK JI-CHAN;BANG JUNG-UP;KIM DONG-HOON;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE KWI-JONG;LEE HYUCK-MO;SONG HYUN-JOON;JO YUN-HWAN;PARK JI-CHAN;BANG JUNG-UP;KIM DONG-HOON |
| 分类号 |
B22F9/18;B82Y40/00 |
主分类号 |
B22F9/18 |
| 代理机构 |
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