THIN SECTION SAMPLE PREPARATION DEVICE

摘要

In order to considerably further shorten preparation time of thin section samples, this thin section sample preparation device is configured to perform: rough cutting in which thin slicing operations are performed on a surface layer part of a sample block by means of a cutter, the cut surface is imaged with an imaging unit, and, until the exposed surface area of the subject in said cutting surface is at least a predetermined surface area, thin cutting operations are performed varying the amount of fine cutting of the surface layer part of the sample block depending on the exposed surface area of the subject; and primary cutting in which, when the exposed surface area of the subject is greater than or equal to the predetermined surface area, fine cutting operations are performed with the amount of thin cutting of the surface layer area of the sample block set to a preset amount.