SEMICONDUCTOR LIGHT EMITTING DEVICE AND HEAD MOUNTED DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To directly join a thin film semiconductor light emitting element to an organic insulation layer through intermolecular force even though hillocks are formed on an aluminum metal layer.

SOLUTION: A semiconductor light emitting device 1 comprises: a substrate 21; a thin film semiconductor light emitting element 300; an organic insulation layer 13 having a smooth surface S and a thickness that enable direct joining to the thin film semiconductor light emitting element 300 through intermolecular force; and an aluminum metal layer 11 laminated on the substrate side of the organic insulation layer. An inorganic insulation layer 12 is formed between a substrate side surface of the organic insulation layer and a substrate opposite side surface of the aluminum metal layer, and hillocks H formed on the substrate opposite side surface of the aluminum metal layer are covered with the inorganic insulation layer.

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