| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing/die-bonding tape which is difficult to cause peeling of a peeling auxiliary film and a dicing tape, and can reduce pickup failure of a semiconductor chip. <P>SOLUTION: The dicing/die-bonding tape 1 includes a dicing tape 2, a peeling auxiliary film 3 laminated on the dicing tape 2, and a die-bonding film 4 laminated on the peeling auxiliary film 3. The peeling auxiliary film 3 consists of a (meta)acrylic acid ester resin film, and the adhesive force of the peeling auxiliary film 3 on the dicing tape 2 side is set higher than that on the die-bonding film 4 side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
