发明名称 PRINTED CIRCUIT BOARD
摘要 A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.
申请公布号 US2012273258(A1) 申请公布日期 2012.11.01
申请号 US201113156359 申请日期 2011.06.09
申请人 CHEN YUNG-CHIEH;HSU SHOU-KUO;LIANG HSIEN-CHUAN;YEN SHIN-TING;WU DAN-CHEN;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 CHEN YUNG-CHIEH;HSU SHOU-KUO;LIANG HSIEN-CHUAN;YEN SHIN-TING;WU DAN-CHEN
分类号 H05K1/09 主分类号 H05K1/09
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