发明名称 |
SEMICONDUCTOR WAFER-TO-WAFER BONDING FOR DISSIMILAR SEMICONDUCTOR DIES AND/OR WAFERS |
摘要 |
A process for wafer-to-wafer bonding of a first wafer having a first set of dies of a first die size to a reconstituted wafer of a second set of dies having a second die size different than the first die size. The process includes aligning the second set of dies such that a second set of interconnects on the second set of dies aligns with a first set of interconnects on the first set of dies. The second set of dies includes a spacing between the second set of dies based on parameters of the first set of dies. The process also includes coupling the reconstituted wafer with the first wafer to create a wafer stack. |
申请公布号 |
US2012276716(A1) |
申请公布日期 |
2012.11.01 |
申请号 |
US201213545393 |
申请日期 |
2012.07.10 |
申请人 |
CHANDRASEKARAN ARVIND;HENDERSON BRIAN M.;QULCOMM INCORPORATED |
发明人 |
CHANDRASEKARAN ARVIND;HENDERSON BRIAN M. |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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