| 发明名称 |
HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. |
| 申请公布号 |
US2012273116(A1) |
申请公布日期 |
2012.11.01 |
| 申请号 |
US201213536815 |
申请日期 |
2012.06.28 |
| 申请人 |
SOHN YOUNG HO;CHOI SEOG MOON;PARK SUNG KEUN;LEE YOUNG KI;JANG BUM SIK;PARK JI HYUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SOHN YOUNG HO;CHOI SEOG MOON;PARK SUNG KEUN;LEE YOUNG KI;JANG BUM SIK;PARK JI HYUN |
| 分类号 |
B32B38/04;B32B38/08 |
主分类号 |
B32B38/04 |
| 代理机构 |
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