发明名称 PHENOLIC COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF
摘要 A phenolic compound which can be obtained by reacting the compound of the formula (1): wherein R1 groups are each independently present and represent a hydrogen atom etc. with the formula (6): wherein R4 groups are each independently present and represent a hydrogen atom etc.; and k represents the number of R4 groups and is an integer of 0 to 4 and an epoxy resin which can be obtained by reacting the phenolic compound with an epihalohydrin are excellent in solvent solubility and also of which cured product has an excellent thermal conductance.
申请公布号 KR20120120267(A) 申请公布日期 2012.11.01
申请号 KR20127019904 申请日期 2011.01.28
申请人 发明人
分类号 C08G59/20;C07C49/753;C07C49/84;C08J5/24 主分类号 C08G59/20
代理机构 代理人
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