| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a composite wiring board, in which a sealing resin is easily filled so that excellent productivity is achieved. <P>SOLUTION: A composite wiring board includes: a first wiring board 1; a second wiring board 2 bonded on a top surface of the first wiring board 1; and a third wiring board 3 bonded on a top surface of the second wiring board 2, and a sealing resin 5 is filled in a space between the first wiring board 1 and the second wiring board 2 and a space between the second wiring board 2 and the third wiring board 3. A flow channel 4 for the sealing resin 5 is formed from the top surface of the second wiring board 2 or the top surface of the third wiring board 3 to the space between the second wiring board 2 and the third wiring board 3, and the space between the first wiring board 1 and the second wiring board 2. The sealing resin 5 is poured, through the flow channel 4, from the top surface of the wiring board 2 or the top surface of the third wiring board 3 to the space between the second wiring board 2 and the third wiring board 3, and the space between the first wiring board 1 and the second wiring board 2, to seal the spaces. <P>COPYRIGHT: (C)2013,JPO&INPIT |
