发明名称 METHOD FOR PROCESSING WORKPIECE AND METHOD FOR DIVIDING WORKPIECE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for processing a workpiece to be divided that can not only inhibit formation of a processing damage but also form a division starting point for dividing the workpiece more surely. <P>SOLUTION: The method for forming a division starting point on a workpiece includes: a placing process that places a workpiece on a stage; a transparent member disposing process that disposes a transparent member, which is practically transparent to a pulse laser beam used for processing, adjacent to the processed surface of the workpiece placed on the stage; and an irradiation process that forms the starting point for dividing the workpiece by sequentially creating a cleavage or dehiscence of the workpiece between the irradiated areas each other by irradiating the pulse laser beam onto the workpiece so that each of the irradiated areas per unit pulse beam is discretely formed on the processed surface while continuously and relatively moving the stage and the light source and transmitting the pulse laser beam through the transparent member. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012210657(A) 申请公布日期 2012.11.01
申请号 JP20120135337 申请日期 2012.06.15
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 NAGATOMO SHOHEI;NAKATANI IKUYOSHI;SUGATA MITSURU
分类号 B23K26/00;B23K26/38;B28D5/00;H01L21/301 主分类号 B23K26/00
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