发明名称 METALLIC HOUSING, METHOD FOR MAKING THE SAME AND ELECTRONIC DEVICE USING THE SAME
摘要 A metallic housing for an electronic device, the metallic housing includes a main body defining a receiving chamber for receiving electronic components and an opening communicating with the receiving chamber, and a covering plate positioned on the main body adjacent to a side of the main body. The covering plate is welded to the main body by friction stir welding and a welded region is formed on a side surface of the metallic housing such that the welded region is smooth with the main body and the covering plate. A method for making the metallic housing and an electronic device using the metallic housing is also disclosed.
申请公布号 US2012275090(A1) 申请公布日期 2012.11.01
申请号 US201113158611 申请日期 2011.06.13
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 WANG WEI-TING;CHIU YU-WEN;LEE CHUN-LANG
分类号 H05K5/00;B23K20/12;B23K31/02 主分类号 H05K5/00
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