发明名称 |
METALLIC HOUSING, METHOD FOR MAKING THE SAME AND ELECTRONIC DEVICE USING THE SAME |
摘要 |
A metallic housing for an electronic device, the metallic housing includes a main body defining a receiving chamber for receiving electronic components and an opening communicating with the receiving chamber, and a covering plate positioned on the main body adjacent to a side of the main body. The covering plate is welded to the main body by friction stir welding and a welded region is formed on a side surface of the metallic housing such that the welded region is smooth with the main body and the covering plate. A method for making the metallic housing and an electronic device using the metallic housing is also disclosed. |
申请公布号 |
US2012275090(A1) |
申请公布日期 |
2012.11.01 |
申请号 |
US201113158611 |
申请日期 |
2011.06.13 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
WANG WEI-TING;CHIU YU-WEN;LEE CHUN-LANG |
分类号 |
H05K5/00;B23K20/12;B23K31/02 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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