| 摘要 |
<p>Provided is flexible printed circuit (FPC) integrated with a reinforcing plate, the flexible printed circuit having small warpage and exhibiting excellent adhesion with an insulation film and a heat-curable adhesive agent disposed on the reinforcing plate. A flexible printed circuit integrated with a reinforcing plate, the flexible printed circuit being configured, in the following order, from a reinforcing plate (A), a heat-curable adhesive agent (B), an insulating film (C), and a film (D) with a wiring pattern, wherein the insulating film (C) at least contains a binder polymer (a) and spherical organic beads (b).</p> |
