| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which is improved in surface hardness, cold impact properties, plating resistance and insulation properties and excellent in folding endurance and solder heat resistance. <P>SOLUTION: A photosensitive composition contains at least an ethylenically unsaturated group-containing polyurethane resin, a polymerizable compound, a photopolymerization initiator and a thermal crosslinking agent. The ethylenically unsaturated group-containing polyurethane resin has an ethylenically unsaturated group equivalent weight of 1.2 mmol/g or more and 1.5 mmol/g or less and a mass composition ratio of aromatic groups of 30% by mass or more. The thermal crosslinking agent contains at least any of an epoxy compound, an oxetane compound, a compound obtained by reacting a blocking agent with an isocyanate compound and a melamine derivative. The ethylenically unsaturated group-containing polyurethane resin is a photosensitive composition containing a structural unit represented by the following general formula (I). <P>COPYRIGHT: (C)2013,JPO&INPIT |
