| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel Cu alloy film which has high adhesion to a substrate and/or an insulation film and exhibits low electric resistivity even after a heat treatment subjected in a manufacturing process of a liquid crystal display device, etc. <P>SOLUTION: The Cu alloy film contacts with a substrate and/or an insulation film directly on the substrate, wherein the Cu alloy film comprises a Cu-Mn-X alloy layer (a first layer) that contains X (X is at least one element selected from a group consisting of Ag, Au, C, W, Ca, Mg, Al, Sn, B and Ni) as an alloy component and a layer (a second layer) that comprises pure Cu or a Cu alloy mainly composed of Cu and having lower electric resistivity than that of the first layer. The first layer and the second layer are arranged in this order from the substrate side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
