| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel Cu alloy film which has high adhesion to a substrate and/or an insulation film and exhibits low electric resistivity even after a thermal treatment performed in a manufacturing process for a liquid crystal display device or the like. <P>SOLUTION: There is provided a Cu alloy film for a display device and the Cu alloy film is made of a Cu-Mn-B alloy. If a Mn amount and a B amount in the depth direction of 50 nm (II) from the interface (I) of a substrate side of the Cu alloy film to the outermost surface of the Cu alloy film are defined as a Mn amount (Mn<SB POS="POST">I-II</SB>) and a B amount (B<SB POS="POST">I-II</SB>), respectively, and if a Mn amount and a B amount in the depth direction from the depth of 50 nm (II) of the Cu alloy film to the outermost surface (III) of the Cu alloy film are defined as a Mn amount (Mn<SB POS="POST">II-III</SB>) and a B amount (B<SB POS="POST">II-III</SB>), respectively, the relation between Mn<SB POS="POST">I-II</SB>and Mn<SB POS="POST">II-III</SB>of the Mn amount satisfies 2.0≤(Mn<SB POS="POST">I-II</SB>/Mn<SB POS="POST">II-III</SB>) and the relation between B<SB POS="POST">I-II</SB>and B<SB POS="POST">II-III</SB>of the B amount satisfies 1.5≤(B<SB POS="POST">I-II</SB>/B<SB POS="POST">II-III</SB>). <P>COPYRIGHT: (C)2013,JPO&INPIT |
