发明名称 |
LASER PROCESSING SYSTEMS AND METHODS FOR BEAM DITHERING AND SKIVING |
摘要 |
A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
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申请公布号 |
US2012273472(A1) |
申请公布日期 |
2012.11.01 |
申请号 |
US201113279993 |
申请日期 |
2011.10.24 |
申请人 |
UNRATH MARK A.;BERWICK ANDREW;MYACHIN ALEXANDER A.;ELECTRO SCIENTIFIC INDUSTRIES, INC. |
发明人 |
UNRATH MARK A.;BERWICK ANDREW;MYACHIN ALEXANDER A. |
分类号 |
B23K26/073;B29C59/16 |
主分类号 |
B23K26/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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