| 摘要 |
PURPOSE: A photosensitive resin composition is provided to have high taper angle, an excellent adhesion with a substrate, and to be used as a sensitized material. CONSTITUTION: A polymer comprises a repeating unit indicated in chemical formula 1, a repeating unit indicated in chemical formula 2, a repeating unit indicated in chemical formula 3, and one or more kinds of repeating units indicated in chemical formula 4, chemical formula 5, and chemical formula 6. An acid value of the polymer is 30-300 KOH mg/g and weight average molecular weight is 5,000-50,000. The sensitive resin composition comprises a binder resin comprising the polymer, a polymerizable compound comprising ethylenically unsaturated bond, and a photoinitiator, and a solvent. |
