| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding material for an electronic component, whose linear expansion coefficient and elastic modulus in a temperature range lower than a glass transition temperature become low after curing, thereby allowing a highly reliable assembly to be obtained. <P>SOLUTION: The bonding material for an electronic component contains a curable compound, a curing agent, and polyimide particles. An average particle diameter of the polyimide particles is 0.03-3 μm, and a CV value of particle diameter is 10-50%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
