| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive metal base substrate which uses aluminium as a metal plate for a circuit, prevents cracks in an alumina layer even when the alumina layer is included as an insulation layer, and has excellent heat radiation performance and manufacturability, and to provide a manufacturing method of the metal base substrate. <P>SOLUTION: A base plate 1 including aluminum or aluminum alloy is prepared, and anodic oxidation treatment and sealing treatment are performed on the entire surface of the base plate 1 to form an alumina layer 2. Then, the alumina layer 2 on one surface of the base plate 1 is removed by polishing to form an electronic component mounting part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
