发明名称 |
HEAT CONDUCTING MOUNTING STRUCTURE, METHOD AND RADIO BASE STATION HOUSING ARRANGEMENT FOR MOUNTING ELECTRONIC MODULES |
摘要 |
Heat conducting mounting structure for mounting of electronic modules, comprising first surface area that is adapted to face a second surface area of the electronic module; cavity means embedded at a distance from the first surface area; said cavity means is adapted to receive a cooling means; attachment means at the first surface area adapted for attaching the electronic module; and wherein the attachment means is adapted for a transfer of the heat energy from the electronic module to the mounting structure. Further a method for mounting the electronic module on the heat conducting mounting comprising the step of adjoining an attachment means with a fixing means and the fixing means with the electronic module to obtain at least one immediate connection pressure area between the first surface area of a wall and the second surface area of the electronic module. Also a radio base station housing arrangement is provided. |
申请公布号 |
EP2517541(A1) |
申请公布日期 |
2012.10.31 |
申请号 |
EP20090852655 |
申请日期 |
2009.12.23 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
EKSTEDT, ULF;JOHANSSON, MIKAEL |
分类号 |
H05K7/20;H02B1/50;H05K7/14 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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