发明名称 |
LIGHT EMITTING DEVICE MODULE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: A light emitting device module and a manufacturing method thereof are provided to directly install a light emitting device on a substrate and to directly install a lens having various shapes on the substrate. CONSTITUTION: An LED(Light Emitting Diode) module includes a substrate(110), a light emitting device(130), a fluorescent body layer(140), and a lens unit(150). The light emitting device is installed on the substrate through a bump(120). The fluorescent body covers the light emitting device. The lens unit is directly formed on the substrate. The lens unit covers the fluorescent body. |
申请公布号 |
KR20120119350(A) |
申请公布日期 |
2012.10.31 |
申请号 |
KR20110037215 |
申请日期 |
2011.04.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HAK HWAN;MOON, KYUNG MI;PAEK, HO SUN;SONG, YOUNG HEE |
分类号 |
H01L33/50;H01L33/58 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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