| 摘要 |
This invention is to provide a treating apparatus capable of providing bubble-free treating liquid to the substrates. The treating apparatus utilizes the treating liquid provided by the treating liquid providing apparatus to treat the surface of the conveyed substrates, and the aforementioned treating liquid providing apparatus comprises: main liquid storage part, connected with liquid providing pipes for providing treating liquid; outflowing holes, provided at the lower end of the main liquid storage part to enable the treating liquid provided by the liquid providing pipes and stored in the main liquid storage part to flow out; auxiliary liquid storage part, used for storing the treating liquid flowing out from the outflowing holes; a slit, provided at the auxiliary liquid storage part and providing the treating liquid flowing from the outflowing holes to the auxiliary liquid storage part onto the substrates; and first air discharging pipes, provided at the auxiliary liquid storage part and communicated with the atmosphere to discharge the air bubble flowing out together with the treating liquid from the outflowing holes to the atmosphere. |
