FLUX FOR SOLDER PASTE, SOLDER PASTE, AND SOLDER BUMP, AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A flux for a solder paste, a solder paste, and a solder bump, and a manufacturing method thereof are provided to maximize the active force of a second activator while minimizing the quantity of the second activator. CONSTITUTION: A flux for a solder paste comprises resin, plasticizer, solvent, and activator. The plasticizer comprises one or more elements in the group of dibutyl phthalate(DBP), benzylbutyl phthalate(BBP), dioctyl phthalate(DOP), dioctyl sebacate(DOS), and dioctyl azelate(DOZ). The solvent comprises one or more elements in the group of glycolether, glycerin, and alcohol. The alcohole comprises one or more elements in a group of n-hexanol, n-decanol, n-dodecanol, and trimethyl nonylalcohol. [Reference numerals] (ST10) Step for preparing a substrate; (ST20) Step for forming patterns on a dry film; (ST30) Step for charging solder paste; (ST40) Step for reflowing the solder paste; (ST50) Step for removing the dry film