| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition having good thermal conductivity, excellent in coating operability, and showing little deterioration of spreading properties after coating, and to provide a semiconductor device having a stable adhesive layer thickness by using the thermally conductive resin composition. <P>SOLUTION: The thermally conductive resin composition comprises a thermally conductive filler (A), a thermosetting resin (B), and a compound (C) having a sulfide bond and a hydroxy group. Also disclosed is a semiconductor device manufactured by using the thermally conductive resin composition. <P>COPYRIGHT: (C)2009,JPO&INPIT |
