| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that efficiently dissipate heat using a bonding wire 9i. <P>SOLUTION: The semiconductor device has a semiconductor chip 1a which draws a main current in a main electrode 11b, a support substrate 4 for heat dissipation which dissipates heat outside generated in the semiconductor chip 1a in which the main current flows, an insulating substrate 2 to conduct heat, being provided between the semiconductor chip 1a and the support substrate 4 for heat dissipation, a dummy conductor film 3d in which the main current does not flow, being provided on the insulating substrate 2, and being not connected to external lead terminals 7a-7d which perform input/output of current or voltage with outside, and a bonding wire 9i which connects the dummy conductor film 3d in which the main current does not flow, the main electrode 11b, and the dummy conductor film 3d. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
