发明名称 |
METHOD FOR MOUNTING CHIPS USING LATERAL SIDE, CHIP ASSEMBLY MOUNTED BY THE SAM, AND METHOD FOR MANUFACTURING CHIP FOR THE SAME |
摘要 |
<p>PURPOSE: A chip laminating method, a chip assembly laminated by the same, and a chip manufacturing method for the same are provided to electrically connect a chip pad exposed on a side of a chip in a simple process such as thermo-compression bonding. CONSTITUTION: A chip laminating structure of a chip(100)-first insulating layer(310)-chip is formed. A second insulating layer(320) is laminated on a side of the chip laminating structure. A conductive connecting member(340) is compressed inside the second insulating layer. One or more bumps(330) is formed in the conductive connecting member. A side of a chip pad(110) is exposed in the chip laminating structure. The bump is contacted with the chip pad.</p> |
申请公布号 |
KR20120119264(A) |
申请公布日期 |
2012.10.31 |
申请号 |
KR20110037073 |
申请日期 |
2011.04.21 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
LEE, SEUNG SEOB;KIM, SUN RAK;KIM, IL |
分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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