发明名称 |
Method and system for inter-chip communication via package waveguides |
摘要 |
<p>Methods and systems for inter-chip communication via integrated circuit package waveguides are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more waveguides integrated in a multi-layer package. The integrated circuits may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuits or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.
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申请公布号 |
EP2105961(A3) |
申请公布日期 |
2012.10.31 |
申请号 |
EP20090004461 |
申请日期 |
2009.03.27 |
申请人 |
BROADCOM CORPORATION |
发明人 |
ROFOUGARAN, AHMADREZA |
分类号 |
H01L23/66;H01L23/498;H01L23/538;H01L25/065 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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