| 摘要 |
A method of manufacturing a multi-layer circuit board assembly from a plurality of printed circuit boards is described. Circuits on layers of at least two printed circuit boards are electrically connected by plated via holes drilled through the joined printed circuit board assembly. RF matching pads provided on at least one of the circuits are used to provide the desired insertion loss and impedance characteristics over the desired RF operating frequency band. The need to perform back-drill and back-fill operations can be eliminated by the method described. |
