| 摘要 |
PURPOSE: A semiconductor device manufacturing apparatus is provided to increase quality of a semiconductor device having a penetration electrode and to manufacture a semiconductor device having a penetrating electrode in a wet process. CONSTITUTION: A support unit(2) supports a wafer(10). Process fluid is supplied to a supply unit(3). The support unit includes an accommodating device(31) and a supplying device(32). The supplying device includes a supply hole. The process fluid is supplied to an accommodating groove(311). The supply hole is connected to a first flow path and the accommodating groove. The accommodated process fluid is moved by the process fluid discharged from the supply hole. [Reference numerals] (20) Process fluid storage unit
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