发明名称 Flooring system
摘要 <p>The flooring system comprises a number of boards adapted to be laid in side by side and end to end relationship to create a floor surface, some of said boards 10 being of first size with a first thickness and some of said boards 20 being of a second size with a second thinner thickness, and at least one inlay board 30, 40 with a third thickness such that the combined thickness of the inlay board and the second size of boards is substantially equal to thickness of the first size of boards. In use the boards are laid to create a floor surface with boards of a second size forming the shape of the footprint of the inlay board to create a recess "A" the shape of the inlay board, and said inlay board being placed in the recess to create a floor with an inlay. The inlay may be temporarily secured to the second boards by use of a friction fit means, hook and loop fasteners or magnets.</p>
申请公布号 GB201216377(D0) 申请公布日期 2012.10.31
申请号 GB20120016377 申请日期 2012.09.13
申请人 WADEIA, WADEIA S 发明人
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