发明名称 INERTIAL SENSOR AND MANUFACTURING METHOD OF THE SAME
摘要 PURPOSE: An inertial sensor and a manufacturing method thereof are provided to combine a sensor unit of the inertial sensor with a lower cap of the inertial sensor by using a silicon-direct bonding method. CONSTITUTION: A sensor unit(110) includes a driving unit(111), a flexible board unit(112), and a support body(113). The driving unit is installed on the flexible board unit. The support unit supports the driving unit floating. The support unit is formed of silicon. A lower cap(120) covers a lower part of the driving unit. The lower cap is formed of silicon. The lower cap and the sensor unit are combined by using a silicon-direct bonding method.
申请公布号 KR20120119845(A) 申请公布日期 2012.10.31
申请号 KR20110038067 申请日期 2011.04.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, HYUN KEE;PARK, HEUNG WOO;PARK, NAM SU;LEE, YEONG GYU;CHO, SUNG MIN
分类号 G01P15/08;G01P13/00;H01L21/64 主分类号 G01P15/08
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