发明名称 |
INERTIAL SENSOR AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PURPOSE: An inertial sensor and a manufacturing method thereof are provided to combine a sensor unit of the inertial sensor with a lower cap of the inertial sensor by using a silicon-direct bonding method. CONSTITUTION: A sensor unit(110) includes a driving unit(111), a flexible board unit(112), and a support body(113). The driving unit is installed on the flexible board unit. The support unit supports the driving unit floating. The support unit is formed of silicon. A lower cap(120) covers a lower part of the driving unit. The lower cap is formed of silicon. The lower cap and the sensor unit are combined by using a silicon-direct bonding method.
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申请公布号 |
KR20120119845(A) |
申请公布日期 |
2012.10.31 |
申请号 |
KR20110038067 |
申请日期 |
2011.04.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, HYUN KEE;PARK, HEUNG WOO;PARK, NAM SU;LEE, YEONG GYU;CHO, SUNG MIN |
分类号 |
G01P15/08;G01P13/00;H01L21/64 |
主分类号 |
G01P15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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