Multi-layer circuit board for electronic circuit unit mounted in vehicle, has outermost resin layer whose coefficient of thermal conductivity is greater than thermal conductivity of inner resin layer

摘要

The board (10) has several conductor layers (L1-L6) and several resin layers (P1-P5) that which are alternately stacked on each other. Electronic components (11,12) are arranged at an outermost conductor layers, which generates heat during operation. The outermost resin layer and outermost conductor layer are closer to each other. The coefficient of thermal conductivity of the outermost resin layer is greater than the thermal conductivity of the inner resin layer.