| 摘要 |
<p>PURPOSE: A semiconductor package and a method for forming the same are provided to prevent electrical failure of a semiconductor chip due to an ion created in substrate by attaching the semiconductor chip to the substrate as a face up type. CONSTITUTION: A semiconductor chip(10) comprises a first surface(10A) and a second surface(10B). A bonding pad(11) is formed on the first surface. An absorption prevention layer(20) is formed on the first surface of the semiconductor chip and the bonding pad. The absorption prevention layer comprises one or more holes(21) exposing the bonding pad. The second surface of the semiconductor chip is attached to a substrate by the medium of an adhesive member(80). A conductive layer pattern(50) is formed on the absorption prevention layer and an insulating member(40).</p> |
