| 摘要 |
A packaging device of an image sensor includes a supporting seat and the image sensor. The supporting seat is a hollow frame having a predetermined thickness, a first surface, a second surface, and an inner edge receding from the second surface toward the first surface to form a recessed step. Plural contacts in the recessed step and in the outer periphery of the supporting seat are electrically connected by plural electrical connection structures. The image sensor has an active surface set on the recessed step by a flip-chip packaging technique. The image sensor also has plural conductive ends electrically connected to the contacts in the recessed step. An insulating material covers an inactive surface of the image sensor and fills the gap between the recessed step of the supporting seat and the image sensor to provide dust-proofness, shock resistance, and prevention against static electricity and leakage of light. |
