Process for preparing a heatsink system and heatsink system obtainable by said process

摘要

The invention provides a process for preparing a heatsink system for a heat generating electronic device, comprising the steps of: (a) providing a heat conducting substrate; (b) applying an insulating layer on the heat conducting substrate; and (c) applying a printed circuit on the isolating layer by means of a hot embossing system. The invention further provides a heatsink system obtainable by said process, comprising a heat conducting substrate, an insulating layer that is applied on the heat conducting substrate, and a printed circuit that is applied on the insulating layer, wherein the thickness of the part of the insulating layer which is arranged between the heat conducting substrate and the printed circuit is between 1 and 100 micron.