| 摘要 |
<p>Abstract Method for slicing wafers from a workpieceA method for slicing wafers from a workpiece, comprising during a sawing operation moving wire sections - arranged in a parallel fashion - of a sawing wire relative to the workpiece, thus giving rise to the wafers, wherein the wire sections are tensioned between two wire guide rolls each having a grooved coating having a specific thickness; and measuring a change in the length of the coating of one of the wire guide rolls, said change being brought about by temperature change, with the aid of rings fixed exclusively to the coating at the ends of the coating, by measuring distances between sensors and the rings; and cooling the wire guide rolls in a manner dependent on the measured distances. Fig. 2</p> |
