发明名称 |
Packaged electronic devices having die attach regions with selective thin dielectric layer |
摘要 |
A method for forming a packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least one land pad thereon and a first dielectric layer positioned lateral to the land pad and a non-die attach region. A second dielectric layer is formed on the top substrate surface of the package substrate. An IC die which is mounted to the top substrate surface of the package substrate. An underfill layer is formed between the IC die and the die attach region.
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申请公布号 |
US8298874(B2) |
申请公布日期 |
2012.10.30 |
申请号 |
US201213526116 |
申请日期 |
2012.06.18 |
申请人 |
GALLEGOS BERNARDO;MASUMOTO KENJI;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
GALLEGOS BERNARDO;MASUMOTO KENJI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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