| 摘要 |
<p>Polishing Composition for Polishing Through-Silicon Via (TSV) Wafer and Use of the SameAbstract of the DisclosureA polishing composition for polishing a through-silicon via (TSV) wafer and a method for polishing a TSV wafer using the same are provided. The polishing composition comprises an organic alkaline compound, an oxidizing agent, a chelating agent, silicon oxide abrasive particles, and a solvent. By using the polishing composition, silicon and conductive materials can be simultaneously polished to significantly save the necessary working-hour costs for polishing TSV wafers.Figure 3</p> |
