发明名称 |
POLISHING PAD, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE |
摘要 |
<p>Disclosed is a polishing pad that can reduce tiny undulations on the surface of an object to be polished. Also disclosed are a method for manufacturing said polishing pad and a method for manufacturing a semiconductor device. The disclosed polishing pad has a polishing layer comprising a thermoset polyurethane foam that contains, as basic ingredients, an isocyanate component and active-hydrogen-containing compounds. Said active-hydrogen-containing compounds include a polyol compound with at least two functional groups and a mono-ol compound with one functional group.</p> |
申请公布号 |
SG183939(A1) |
申请公布日期 |
2012.10.30 |
申请号 |
SG20120066114 |
申请日期 |
2011.03.17 |
申请人 |
TOYO TIRE & RUBBER CO., LTD. |
发明人 |
DOURA, MASATO;ISHIZAKA, NOBUYOSHI |
分类号 |
B24B37/24;C08G18/30;C08G101/00;H01L21/304 |
主分类号 |
B24B37/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|