| 发明名称 |
Conductive paste, printed circuit board, and manufacturing method thereof |
| 摘要 |
A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability. |
| 申请公布号 |
US8298447(B2) |
申请公布日期 |
2012.10.30 |
| 申请号 |
US20080076117 |
申请日期 |
2008.03.13 |
| 申请人 |
KIM KI-HWAN;MOK JEE-SOO;KANG MYUNG-SAM;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KI-HWAN;MOK JEE-SOO;KANG MYUNG-SAM |
| 分类号 |
H01B1/02;B29C44/34;B32B37/00;C08J9/22;H01B1/22 |
主分类号 |
H01B1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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