FLIP CHIP PACKAGE USING ADHESIVE CONTAINING VOLUME EXPANSION ADDITIVES AND ITS JOINING METHOD

摘要

PURPOSE: A flip chip package and a bonding method thereof using adhesive in which volume expansion agent is included are provided to omit an underfill process after a reflow process. CONSTITUTION: A solder ball(15) or a bump is formed on a bonding surface of a chip(10). Adhesive(30) including volume blowing agent is coated on the bonding surface of the chip in order for a part of the solder to be projected. A pad(20) of the bump or the solder ball is bonded through chip mounting and reflow soldering. The adhesive fills a space between the chip and the substrate according to the expansion of the adhesive.