OLED ENCAPSULATION STRUCTURE AND ITS FABRICATION METHOD HAVING HIGH TRANSMITTANCE AND HEAT DISSIPATION CAPABILITY

摘要

PURPOSE: An encapsulating structure of an OLED device and a manufacturing method thereof having high transmittance and high heat radiation is provided to efficiently protect organic compound or a metal electrode which consists of an OLED device from oxygen, carbon dioxide or others. CONSTITUTION: A liquid getter is coated on a flat encapsulation glass(S100). A glass on which the getter is coated is hardened(S200). Gas generated by being hardened is removed(S300). An OLED(Organic Light Emitting Diode) device is adhered by using synthetic resin(S400). The synthesis resin is hardened(S500). [Reference numerals] (S100) Step for coating a liquid getter on an encapsulation glass; (S200) Step for hardening the getter coated glass; (S300) Step for removing gas generated by being hardened; (S400) Step for adhering the encapsulation glass without the gas and an OLED device using a synthetic resin; (S500) Step for hardening a synthetic resin