发明名称 |
Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part |
摘要 |
To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating. |
申请公布号 |
US8298747(B2) |
申请公布日期 |
2012.10.30 |
申请号 |
US20080531055 |
申请日期 |
2008.03.06 |
申请人 |
MINEGISHI TOMONORI;NOGITA RIKA;IWASHITA KENICHI;HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. |
发明人 |
MINEGISHI TOMONORI;NOGITA RIKA;IWASHITA KENICHI |
分类号 |
G03F7/00;G03F7/004;G03F7/027;G03F7/028;G03F7/40 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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