发明名称 |
Wiring board and method of manufacturing the same |
摘要 |
A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.
|
申请公布号 |
US8299370(B2) |
申请公布日期 |
2012.10.30 |
申请号 |
US20100709838 |
申请日期 |
2010.02.22 |
申请人 |
SAKAGUCHI HIDEAKI;SHIRAISHI AKINORI;HIGASHI MITSUTOSHI;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SAKAGUCHI HIDEAKI;SHIRAISHI AKINORI;HIGASHI MITSUTOSHI |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|