发明名称 Wiring board and method of manufacturing the same
摘要 A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.
申请公布号 US8299370(B2) 申请公布日期 2012.10.30
申请号 US20100709838 申请日期 2010.02.22
申请人 SAKAGUCHI HIDEAKI;SHIRAISHI AKINORI;HIGASHI MITSUTOSHI;SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SAKAGUCHI HIDEAKI;SHIRAISHI AKINORI;HIGASHI MITSUTOSHI
分类号 H05K1/11 主分类号 H05K1/11
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