发明名称 |
Stackable treated via package and method |
摘要 |
A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield. |
申请公布号 |
US8300423(B1) |
申请公布日期 |
2012.10.30 |
申请号 |
US20100787238 |
申请日期 |
2010.05.25 |
申请人 |
DARVEAUX ROBERT FRANCIS;BANCOD LUDOVICO;YOSHIDA AKITO;AMKOR TECHNOLOGY, INC. |
发明人 |
DARVEAUX ROBERT FRANCIS;BANCOD LUDOVICO;YOSHIDA AKITO |
分类号 |
H01R9/00;H01K1/18 |
主分类号 |
H01R9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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